"The challenge of testing and burn-in for System in Package"
"系统级封装芯片的测试及老化实验的挑战"
Leo Wang
ISE Labs, member of ASE Group
"Socket Material Characterization & Selection"
"芯片测试插座材料特性和应用"
Jinrong "Cleveland" Chen
Smiths Interconnect
Jiachun "Frank" Zhou
Smiths Interconnect
"Deterministic contact resistance of BGA contact pins"
"BGA 测试探针的接触电阻研究"
Terry Wang
Infineon
Praveen kumar Ramamoorthy
Infineon
Yusman Sugianto
Infineon
"New universal multi-beam Kelvin contactor concept for turret applications"
"新型多功能开尔文接触探针设计"
Mathias Westenhuber
Cohu
Johann Pötzinger
Cohu
Return to the 2017 BiTS China Workshop Archive index page