Opening Remarks
Ira Feldman, BiTS General Chair
Steven Zheng, BiTS China Chair
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"Fan Out Technology Overview"
"针距扩展（fan out）技术综述"
Tingyu Lin
National Centre for Advanced Packaging (NCAP), China
"Market Report - Opportunities and Challenges of the Chinese Test and Burn-in Sockets Market"
"半导体芯片性能和寿命测试插座的中国市场"
"半导体芯片性能和寿命测试插座的中国市场"
Lin Fu
John West
VLSI Research Europe
Return to the 2017 BiTS China Workshop Archive index page