Shanghai Session 2

"WLP Probing Technology Opportunity and Challenge"

"WLP探测技术的机会与挑战"
Clark Liu
PowerTech Technology Inc.

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"Pushing the Envelope in DFM (Design for Manufacturing) for 0.2mm Pitch WLCSP Socket"

"研发和改进WLCSP Socket, 0.2mm 微间距晶圆测试插座的设计与制造."
Colin Koh
Test Tooling Solutions Group

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"Signal Integrity & Impacts by Connector Structures"

"芯片测试探针/座的信号完整性 及其影响"
Jiachun (Frank) Zhou
Smiths Connectors

Dexian Liu
Smiths Connectors

Professor Sun Ling
Jiangsu Key Lab of ASIC Design, Nantong University

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"LPDDR4 Signal & Power Performance Optimization By Hardware"

"通过测试硬件的优化来提升LPDDR4信号和电源的性能"
Yuanjun Shi
Twinsolution Technology

Xiao.Yao
HiSilicon Technologies Co

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